TY  - BOOK
AU  - Tummala,Rao R.
AU  - Rymaszewski,Eugene J.
TI  - Microelectronics packaging handbook
SN  - 0412084317 (pt. 1)
PY  - 1997///
CY  - New York
PB  - Chapman & Hall
KW  - Microelectronic packaging
KW  - Handbooks, manuals, etc
N1  - Includes bibliographical references and index; pt. 1. Technology drivers --  pt. 3. Subsystem packaging
ER  -