Microelectronics packaging handbook / 
edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein 
 - 2nd ed. 
 - New York :  Chapman & Hall,  1997 
 - 3 v. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/>pt. 1. Technology drivers --  pt. 3. Subsystem packaging 
<br/><br/><label>ISBN: </label>0412084317 (pt. 1)  RM885.17 0412084414 (pt. 2) 0412084511 (pt. 3)  RM838.57 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Handbooks, manuals, etc.