TY  - BOOK
AU  - Lau,John H.
AU  - Lee,S.W.Ricky
TI  - Microvias: for low-cost, high-density interconnects 
SN  - 0071363270
PY  - 2001///
CY  - New York
PB  - McGraw-Hill
KW  - Microelectronic packaging
KW  - Integrated circuits
KW  - Design and construction
KW  - Cost control
KW  - Semiconductors
KW  - Junctions
KW  - Printed circuits
UR  - http://www.loc.gov/catdir/toc/mh031/2001030752.html
UR  - http://www.loc.gov/catdir/description/mh031/2001030752.html
ER  -