Lau, John H. <br/><br/>
Microvias :  for low-cost, high-density interconnects / 
John H. Lau, S.W. Ricky Lee 
 - New York :  McGraw-Hill,  2001 
 - xxiii, 565 p. :  ill. ;  24 cm. 
<br/><br/><label>ISBN: </label>0071363270  RM401.80 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging<br/>Integrated circuits--Design and construction--Cost control<br/>Semiconductors--Junctions<br/>Printed circuits