TY  - BOOK
AU  - Lupinski,John H.
AU  - Moore,Robert S.
ED  - American Chemical Society.
ED  - American Chemical Society.
ED  - American Chemical Society.
TI  - Polymeric materials for electronics packaging and interconnection
SN  - 0841216797
PY  - 1989///
CY  - Washington, DC
PB  - American Chemical Society
KW  - Electronic packaging
KW  - Materials
KW  - Congresses
KW  - Polymers
N1  - 'Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.'; Includes bibliographical references
ER  -