Polymeric materials for electronics packaging and interconnection / 
John H. Lupinski, editor, Robert S. Moore, editor 
 - Washington, DC :  American Chemical Society,  1989 
 - xi, 499 p. :  ill. ;  24 cm. 
 - ACS symposium series ;  407 .
<br/><br/> 'Developed from a symposium sponsored by the Divisions of Polymeric Materials: Science and Engineering and of Polymer Chemistry, Inc. at the 196th National Meeting of the American Chemical Society, Los Angeles, California, September 25-30, 1988.' 
<br/><br/>Includes bibliographical references 
<br/><br/><label>ISBN: </label>0841216797  RM100.30 
<br/><br/><label>LCCN: </label>89-037412 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials--Congresses<br/>Polymers--Congresses