TY  - BOOK
AU  - Iyer,Subramanian S.
AU  - Auberton-Herve,Andre J.
ED  - Institution of Electrical Engineers
ED  - Electronic Materials Information Service
TI  - Silicon wafer bonding technology for VLSI and MEMS applications
SN  - 0852960395
PY  - 2002///
CY  - London
PB  - INSPEC
KW  - Silicon-on-insulator technology
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Microelectromechanical systems
ER  -