Mohd. Salleh Ismail. <br/><br/>
Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices / 
by Mohd Salleh Ismail. 
 - Davis, Calif:  University of California,  1993. 
 - 155 p. :  ill. ;  30 cm. 
<br/><br/>Thesis (Doctor of Philosophy) - University of California, 1993. 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductor wafers.<br/>Integrated circuits--Water--scale integration.