TY  - BOOK
AU  - Hwang,Jennie S.
TI  - Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly 
SN  - 0442013531
PY  - 1992///
CY  - New York
PB  - Van Nostrand Reinhold
KW  - Surface mount technology
KW  - Printed circuits
KW  - Design and construction
KW  - Solder pastes
ER  -