Hwang, Jennie S. <br/><br/>
Solder paste in electronics packaging :  technology and applications in surface mount, hybrid circuits, and component assembly / 
Jennie S. Hwang 
 - New York :  Van Nostrand Reinhold,  1992 
 - 456 p. :  ill. ;  23 cm. 
<br/><br/><label>ISBN: </label>0442013531 
<br/><br/><label>Subjects--Personal Names: </label><br/>Surface mount technology
<br/><br/><label>Subjects--Topical Terms: </label><br/>Printed circuits--Design and construction<br/>Solder pastes