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Development of improved solders for electronic reliability : technical report AFML-TR-77-93 final report for period 15 March 1976 to 12 April 1977

Publication details: Springfiled, Va. : National Technical Information Service, 1977Description: 110 p. ; 28 cmSubject(s):

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Holdings
Item type	Current library	Home library	Collection	Call number	Materials specified	Copy number	Status	Date due	Barcode
AM	PERPUSTAKAAN TUN SERI LANANG	PERPUSTAKAAN TUN SERI LANANG KOLEKSI AM-P. TUN SERI LANANG (ARAS 5)	-	TT267.D48 (Browse shelf(Opens below))		1	Available		00000317816

Previous		No cover image available	No cover image available	No cover image available	No cover image available			Next
Previous	TT212.B394 Jewelry & accessories : beautiful designs to make and wear /	TT267.D478 Development of highly reliable soldered joints for printed circuits boards : final report	TT267.D478 n.2 Development of highly reliable soldered joints for printed circuits boards : final report	TT267.D48 Development of improved solders for electronic reliability : technical report AFML-TR-77-93 final report for period 15 March 1976 to 12 April 1977	TT267.G63 The significance of strength for the reliability of solder joints in electronics	TT267.L33 3 Soldering for electronic assemblies /	TT267.M26 1979 Solders and soldering : materials, design, production, and analysis for reliable bonding /	Next

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