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Advances in CMP/polishing technologies for the manufacture of electronic devices / edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.

Contributor(s): Publication details: Oxford : Elsevier, c2012.Description: xii, 317 p. : ill. ; 24 cmISBN:
  • 9781437778595
  • 1437778593
Other title:
  • CMP polishing technologies for the manufacture of electronic devices [Portion of title]
Subject(s): Summary: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.
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Item type Current library Home library Collection Call number Materials specified Copy number Status Date due Barcode
AM PERPUSTAKAAN TUN SERI LANANG PERPUSTAKAAN TUN SERI LANANG KOLEKSI AM-P. TUN SERI LANANG (ARAS 5) - TJ1280.A388 (Browse shelf(Opens below)) 1 Available 00002079564

Includes bibliographical references and index.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. --P. 4 of cover.

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