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Solder Joint Technology Materials, Properties, and Reliability /

Solder Joint Technology Materials, Properties, and Reliability / [electronic resource] : edited by King-Ning Tu. - New York : Springer, 2007. - 386 p. : ill., digital ; 24 cm. - Springer Series in Materials Science, 117 0933-033X ; .

ISBN: 9780387388922 (electronic bk.) 9780387388908 (paper)

Subjects--Topical Terms:
Chemistry.
Electronics and Microelectronics, Instrumentation.
Manufacturing, Machines, Tools.
Metallic Materials.
Optical and Electronic Materials.
Quality Control, Reliability, Safety and Risk.

Dewey Class. No.: 621.381

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