Wire bonding in microelectronics /
Harman, George G.
Wire bonding in microelectronics / George G. Harmon - 3rd ed. - New York : McGraw-Hill, 2010 - xx, 426 p. : ill. ; 24 cm. + 1 computer optical disc (4 3/4 in.)
Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989 Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
9780071476232 : RM260.68
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability
Electronic packaging--Defects
Semiconductors--Failures
Wire bonding in microelectronics / George G. Harmon - 3rd ed. - New York : McGraw-Hill, 2010 - xx, 426 p. : ill. ; 24 cm. + 1 computer optical disc (4 3/4 in.)
Rev. ed. of : Reliability and yield problems of wire bonding in microelectronics, 1989 Book is accompanied by 1 computer optical disc, entitled'Wire bonding in microelectronics, 3rd ed.' bearing the same call number and available at Bahagian Koleksi Media
9780071476232 : RM260.68
Wire bonding (Electronic packaging)--Production control
Electronic packaging--Reliability
Electronic packaging--Defects
Semiconductors--Failures